2024-至今福州大学化学学院，副教授、硕士生导师。

2022-2024，瑞士伯尔尼大学，访学

2019-2024，哈尔滨工业大学，化学工程与技术，博士研究生

2016-2019，哈尔滨工业大学，会计学，学士（第二学位）

2015-2019，哈尔滨工业大学，化学工程与工艺，学士

主要从事金属（合金）电沉积、功能镀层、电催化、理论计算等领域。目前在Adv. Funct. Mater., Nano Res., Small, SusMat, ACS Appl. Mater. Interfaces等期刊上共发表论文70余篇（1作/通讯论文20余篇），论文总被引1400余次，H因子20，获授权发明专利2项。

国家自然科学基金青年科学基金项目（C类），2026-2028，主持。

国家自然科学基金专项项目，2026-2029，参与。

福州大学科研启动基金，2025-2027，主持。

1. X. P., J. Jiang, Y. Li*, et al. Substrate Engineerig for High-performance Ultrathin Copper Foils: Unveiling the Electronic-Geometric Synergy of Low-Range-Order Ni-W Alloys, Adv. Funct. Mater., 2026, e74586.

2. R. Li, Y. Wu,Y. Li*, et al,Cerium Oxide-Induced Synchronous Lattice Oxygen Activation and Accelerated Deprotonation Kineticsin Cobalt(oxy) Hydroxide for Robust Water Oxidation, Small, 2025, 21(10), 2410384.

3. F. Meng, L. Zhu, R. Li*, Y. Li*, et al, Engineering Metal-Support Interaction for Manipulate Microenvironment: Single-Atom Platinum Decorated on Nickel-Chromium Oxides Toward High-Performance Alkaline Hydrogen Evolution,Adv. Funct. Mater., 2024, 35(10), 2416678.

4. Y. Li, P. Ren, M. An*, et al. Elucidating the role of P on Mn- and N-doped graphene catalysts in promoting oxygen reduction: Density functional theory studies, SusMat, 2023, 3(3), 390-401.

5. Y. Li, R. Li, M. An*, et al. Theoretical and experimental research on electroplating additives in chip metal interconnects. Sci. Sin. Chim., 2023, 53(10), 1970-1988.

6. Y. Li, C. Li, P. Broekmann*, et al, Experimental and Theoretical Study of the New Leveler Basic Blue 1 during Copper Superconformal Growth,ACS Appl. Mate. Interfaces., 2023, 15, 47628-47639.