李亚强

职 称: 副教授

学 历: 博士研究生

硕士招生专业: 材料化学、物理化学、材料工程

博士招生专业:

电子邮件: liyaqiang@fzu.edu.cn

研究方向: 1. 半导体金属互连电镀技术。 2. 绿色电镀技术、功能镀层电镀技术、合金电镀技术。 3. 电催化材料设计与合成及机理研究。 4. DFT计算、分子动力学模拟、多场有限元模拟。

课题组网页:

教育工作经历 (Education and working experiences)

2024-至今福州大学化学学院,副教授、硕士生导师。

2022-2024,瑞士伯尔尼大学,访学

2019-2024,哈尔滨工业大学,化学工程与技术,博士研究生

2016-2019,哈尔滨工业大学,会计学,学士(第二学位)

2015-2019,哈尔滨工业大学,化学工程与工艺,学士

科研简介 (Scientific research)

主要从事金属(合金)电沉积、功能镀层、电催化、理论计算等领域。目前在在Angew,Adv. Funct. Mater., Appl. Catal. B Environ.,ACSNano,SusMat,ACS Appl. Mater. Interfaces等期刊上共发表论文60余篇(1作/通讯论文20余篇),论文总被引1000余次,H因子17;获授权发明专利2项。

科研项目 (Scientific research projects)

国家自然科学基金青年科学基金项目(C类),2026-2028,主持。

福州大学科研启动基金,2025-2027,主持。

代表性论文 (Representative papers)

1.R. Li, Y. Wu, P. Yang, D. Wang, H. Xu,Y. Li*, et al,CeriumOxide-InducedSynchronousLatticeOxygen ActivationandAcceleratedDeprotonationKineticsinCobalt(oxy)HydroxideforRobustWaterOxidation,Small, (2025), 2410384.

2.L. Meng, J. Jiang,Y. Li*, et al, Theoretical and Experimental Study of Functional Additives in Au(I)-DMH Cyanide-Free Gold Electroplating System,Langmuir, 2025, https://doi.org/10.1021/acs.langmuir.5c02124.

3.Y. Li, X. Peng, R. Li *, et al, Insights into the role of Basic Blue 7 as a leveler in copper superfilling within microvias.New J. Chem., 49 (2025), 12079.

4.H. Xu, R. Li,Y. Li*, et al, Research progress of atomically dispersed iron, nitrogen co-coordinated carbon catalysts for oxygen reduction: a mini-review,J. Mater. Chem. A, 2025.

5.X. Peng, X. Zhou, J. Jiang,Y. Li*, et al, Theoretical Research and Application of Additive DPS in the Electrochemical Microroughening Layer of Copper Foil,Langmuir, 41(2025), 6081-6091.

6.Y. Wu, P. Ren, R. Li,Y. Li*, et al,Investigation of the structure-activity relationship of phosphorus-doped Fe-Cu@NC catalysts: Exploring the influence of different coordination layers on oxygen reduction reaction activity,J. Power Sources, 631(2025), 236302.

7.M. Li, X. Peng, J. Jiang,Y. Li*, et al,Filling performance of an Acid Blue 1 leveler on blind microvias,New J. Chem., 49 (2025), 4538.

8.M. Niu, L. Dong*, J. Yue,Y. Li, J. Liang*, S. Xin*,A Fast-Charge Graphite Anode with a Li-Ion-Conductive, Electron/Solvent-Repelling Interface,Angew. Chem. Int. Ed., 63 (21) (2024), e202318663.

9.F. Meng, L. Hao, R. Li*, J. Jiang,Y. Li*, et al, Engineering Metal-Support Interaction for Manipulate Microenvironment: Single-Atom Platinum Decorated on Nickel-Chromium Oxides Toward High-Performance Alkaline Hydrogen Evolution,Adv. Funct. Mater., (2024) 2416678.

10.M. Li, X. Li,Y. Li*, et al, Investigation of novel brightener acid blue 1 on copper electroplating coating,Ionics, 31(2024), 1061-1075.

11.彭雪嵩,江杰,李亚强*,等,先进电子制造电子电镀技术征文基于有限元方法分析加速剂SPS对铜柱凸点互连均匀性的影响,电镀与精饰, 47(3) (2024), 10-17.

12.Y. Li, P. Ren, X. Lu, M. An*, et al. Elucidating the role of P on Mn- and N-doped graphene catalysts in promoting oxygen reduction: Density functional theory studies,SusMat, 3 (3) (2023) 390-401.

13.Y. Li, X. Ma, M. An*, Investigation of novel suppressor Nitrotetrazolium Blue chloride on cobalt superconformal growth,J. Manuf. Process., 101 (2023), 15-24.

14.Y. Li, C. Li, P. Broekmann*, et al, Experimental and Theoretical Study of the New Leveler Basic Blue 1 during Copper Superconformal Growth,ACS Appl. Mate. Interfaces., 15 (2023), 47628-47639.

15.Y. Li, P. Ren, M. An*, et al. Investigation of novel leveler Rhodamine B on copper superconformal electrodeposition of microvias by theoretical and experimental studies,Appl. Surf. Sci., 615 (2023): 156266.

16.Y. Li, X. Ma, P. Broekmann*, et al, Suppressing-accelerating effect of Nitrotetrazolium Blue chloride in boosting superconformal cobalt filling,J. Electroanaly. Chem., 945 (2023), 117671.

17.Y. Li, P. Ren, R. et al, A novel bright additive for copper electroplating: electrochemical and theoretical study,Ionics, 29 (2023), 363-375.

18.L. Dong, S. Zhong, B. Yuan,Y. Li, W. He*, et al. Reconstruction of Solid Electrolyte Interphase with SrI2 Reactivates Dead Li for Durable Anode-Free Li-Metal Batteries,Angew. Chem. Int. Ed.,62 (23) (2023), e202301073.

19.李亚强,李若鹏,安茂忠,等.芯片金属互连中电镀添加剂的理论与实验研究,中国科学:化学, 53 (2023), 1970-1988.

20.Y. Li, P. Ren, M. An*, et al. The influence of leveler Brilliant Green on copper superconformal electroplating based on electrochemical and theoretical study,J. Ind. Eng. Chem., 118 (2023), 78-90.

21.Y. Li, X. Cai, M. An*, et al. Optimization of electrodeposition nanocrytalline Ni-Fe alloy coatings for the replacement of Ni coatings,J. Alloy. Compd., 903 (2022), 163761.

22.Y. Li, L. Liu, Q. Wei, X. Ren, M. An*, Highly selective separation of acetic acid and hydrochloric acid by alkylamide based on double hydrogen bond coupling mechanism,Sep. Purif. Technol., 275 (2021), 119110.

23.李亚强,马晓川,安茂忠*,等.芯片制程中金属互连工艺及其相关理论研究进展.表面技术, 50 (7) (2021), 24-43,164.

Copyright © 2010-2025 福州大学化学学院版权所有