教育工作经历

2015 – 2019    哈尔滨工业大学化学工程与工艺 本科

2019 – 2024    哈尔滨工业大学化学工程与技术 博士

2022 – 2024    瑞士伯尔尼大学 访学

教学简介

科研简介

科研方向包括金属（合金）电沉积、功能镀层、电催化、理论计算，主要涉及：
1.半导体金属互连电镀技术

2.绿色电镀技术、功能镀层电镀技术、合金电镀技术

3.电催化材料设计与合成及机理研究

4. DFT计算、分子动力学模拟、多场有限元模拟

在Angew, Adv. Funct. Mater., Appl. Catal. B Environ., ACS Nano, SusMat, ACS Appl. Mater. Interfaces等期刊上共发表论文50余篇，（1作/通讯论文20篇），H因子15；授权发明专利2项。

社会兼职

《电化学》、《电镀与涂饰》期刊青年编委

科研项目

代表性论文

# R. Li, Y. Wu, P. Yang, D. Wang, H. Xu, Y. Li *, et al, Cerium Oxide-Induced Synchronous Lattice Oxygen Activation and Accelerated Deprotonation Kinetics in Cobalt (oxy) Hydroxide for Robust Water Oxidation, Small, (2025), 2410384.

# H. Xu, R. Li, Y. Li *, et al, Research progress of atomically dispersed iron, nitrogen co-coordinated carbon catalysts for oxygen reduction: a mini-review, J. Mater. Chem. A, 2025.

# X. Peng, X. Zhou, J. Jiang, Y. Li *, et al, Theoretical Research and Application of Additive DPS in the Electrochemical Microroughening Layer of Copper Foil, Langmuir, 41(2025), 6081-6091.

# Y. Wu, P. Ren, R. Li, Y. Li *, et al, Investigation of the structure-activity relationship of phosphorus-doped Fe-Cu@NC catalysts: Exploring the influence of different coordination layers on oxygen reduction reaction activity, J. Power Sources, 631(2025), 236302.

# M. Li, X. Peng, J. Jiang, Y. Li *, et al, Filling performance of an Acid Blue 1 leveler on blind microvias, New J. Chem., 49 (2025), 4538.

# M. Niu, L. Dong*, J. Yue, Y. Li, J. Liang*, S. Xin*, A Fast-Charge Graphite Anode with a Li-Ion-Conductive, Electron/Solvent-Repelling Interface, Angew. Chem. Int. Ed., 63 (21) (2024), e202318663.

# F. Meng, L. Hao, R. Li *, J. Jiang, Y. Li *, et al, Engineering Metal-Support Interaction for Manipulate Microenvironment: Single-Atom Platinum Decorated on Nickel-Chromium Oxides Toward High-Performance Alkaline Hydrogen Evolution, Adv. Funct. Mater., (2024) 2416678.

# M. Li, X. Li, Y. Li*, et al, Investigation of novel brightener acid blue 1 on copper electroplating coating, Ionics, 31(2024), 1061-1075.

# 彭雪嵩，江杰，李亚强*，等，先进电子制造电子电镀技术征文基于有限元方法分析加速剂SPS对铜柱凸点互连均匀性的影响, 电镀与精饰, 47(3) (2024), 10-17.

#Y. Li, P. Ren, X. Lu, M. An*, et al. Elucidating the role of P on Mn- and N-doped graphene catalysts in promoting oxygen reduction: Density functional theory studies, SusMat, 3 (3) (2023) 390-401.

#Y. Li, X. Ma, M. An*, Investigation of novel suppressor Nitrotetrazolium Blue chloride on cobalt superconformal growth, J. Manuf. Process., 101 (2023), 15-24.

#Y. Li, C. Li, P. Broekmann*, et al, Experimental and Theoretical Study of the New Leveler Basic Blue 1 during Copper Superconformal Growth, ACS Appl. Mate. Interfaces., 15 (2023), 47628-47639.

# Y. Li, P. Ren, M. An*, et al. Investigation of novel leveler Rhodamine B on copper superconformal electrodeposition of microvias by theoretical and experimental studies, Appl. Surf. Sci., 615 (2023): 156266.

# Y. Li, X. Ma, P. Broekmann*, et al, Suppressing-accelerating effect of Nitrotetrazolium Blue chloride in boosting superconformal cobalt filling, J. Electroanaly. Chem., 945 (2023), 117671.

# Y. Li, P. Ren, R. et al, A novel bright additive for copper electroplating: electrochemical and theoretical study, Ionics, 29 (2023), 363-375.

# L. Dong, S. Zhong, B. Yuan, Y. Li, W. He*, et al. Reconstruction of Solid Electrolyte Interphase with SrI2 Reactivates Dead Li for Durable Anode-Free Li-Metal Batteries, Angew. Chem. Int. Ed., 62 (23) (2023), e202301073.

# 李亚强，李若鹏，安茂忠, 等. 芯片金属互连中电镀添加剂的理论与实验研究, 中国科学：化学, 53 (2023), 1970-1988.

# Y. Li, P. Ren, M. An*, et al. The influence of leveler Brilliant Green on copper superconformal electroplating based on electrochemical and theoretical study, J. Ind. Eng. Chem., 118 (2023), 78-90.

# Y. Li, X. Cai, M. An*, et al. Optimization of electrodeposition nanocrytalline Ni-Fe alloy coatings for the replacement of Ni coatings, J. Alloy. Compd., 903 (2022), 163761.

# Y. Li, L. Liu, Q. Wei, X. Ren, M. An*, Highly selective separation of acetic acid and hydrochloric acid by alkylamide based on double hydrogen bond coupling mechanism, Sep. Purif. Technol., 275 (2021), 119110.

# 李亚强，马晓川，安茂忠*,等. 芯片制程中金属互连工艺及其相关理论研究进展. 表面技术, 50 (7) (2021), 24-43,164.

其他

每年招收材料化学、物理化学、计算化学等相关专业研究生1-2名。